HEATING PACK SYSTEM
The present invention relates to a heating pack system and, more specifically, to a heating pack system which uses a phase change material (PCM) having heat absorption properties during a phase change from solid state to liquid state. The heating pack system: can increase heat release time; can impr...
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| Format: | Patent |
| Sprache: | eng ; kor |
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| Zusammenfassung: | The present invention relates to a heating pack system and, more specifically, to a heating pack system which uses a phase change material (PCM) having heat absorption properties during a phase change from solid state to liquid state. The heating pack system: can increase heat release time; can improve adhesion to a user; can reduce an area which does not release heat when the heating pack is erected; can heat a plurality of heating packs by using one power supply source; can easily increase a number of usable heating packs; and can select a heating temperature of the heating pack by increasing or decreasing the number of heating packs. |
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