R-PCB BONDING DEVICE POSSIBLE MULTI-AXIS CORRECTION

The present invention relates to an R-printed circuit board (PCB) bonding device capable of multi-axial correction and, more specifically, an R-PCB bonding device capable of multi-axial correction which includes a multi-axial correction unit to improve bonding quality when a PCB is attached to a TAP...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	LEE, GEON HA
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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