R-PCB BONDING DEVICE POSSIBLE MULTI-AXIS CORRECTION

The present invention relates to an R-printed circuit board (PCB) bonding device capable of multi-axial correction and, more specifically, an R-PCB bonding device capable of multi-axial correction which includes a multi-axial correction unit to improve bonding quality when a PCB is attached to a TAP...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser:	LEE, GEON HA
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	The present invention relates to an R-printed circuit board (PCB) bonding device capable of multi-axial correction and, more specifically, an R-PCB bonding device capable of multi-axial correction which includes a multi-axial correction unit to improve bonding quality when a PCB is attached to a TAP IC formed on the inner side of a display panel. The R-PCB bonding device capable of multi-axial correction includes a support (502) which is longer than the panel and on which the TAP IC of a vertical panel is put for compression and a Z-axial rotation unit which is located on the lower part of the support (502).