GLASS LOADING APPARATUS FOR SEMICONDUCTOR PACKAGE AND ITS LOADING METHOD

The purpose of the present invention provides a glass loading apparatus for a semiconductor package which improves productivity by improving process efficiency by simultaneously mounting all packages mounted on a tray when a glass formed in an image sensor semiconductor package is mounted, and a loa...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	AN, GWANG JIK, GO, JEONG HWAN, KANG, TAE YEONG
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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