GLASS LOADING APPARATUS FOR SEMICONDUCTOR PACKAGE AND ITS LOADING METHOD

The purpose of the present invention provides a glass loading apparatus for a semiconductor package which improves productivity by improving process efficiency by simultaneously mounting all packages mounted on a tray when a glass formed in an image sensor semiconductor package is mounted, and a loa...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: AN, GWANG JIK, GO, JEONG HWAN, KANG, TAE YEONG
Format: Patent
Sprache:eng ; kor
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Beschreibung
Zusammenfassung:The purpose of the present invention provides a glass loading apparatus for a semiconductor package which improves productivity by improving process efficiency by simultaneously mounting all packages mounted on a tray when a glass formed in an image sensor semiconductor package is mounted, and a loading method thereof. The present invention includes a lower jig which is adsorbed to the lower part of a sawed glass with a constant distance; and an upper jig which again adsorbs the glass adsorbed to the lower jig to an upper part and separates it with a constant distance in a direction vertical to a separation direction of the lower jig.