PROCESSING NOZZLE FOR PROCESSING SUBSTRATE
Disclosed is an invention relating to a supply nozzle for a processing substrate. The supply nozzle for a processing substrate includes a nozzle body which has a receiving space for receiving a process solution for processing a substrate, a heat radiation part which is separated and fixed to the noz...
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| creator | SONG, NAC HYUN LEE, SANG CHON |
| description | Disclosed is an invention relating to a supply nozzle for a processing substrate. The supply nozzle for a processing substrate includes a nozzle body which has a receiving space for receiving a process solution for processing a substrate, a heat radiation part which is separated and fixed to the nozzle body part, a transfer body part which is reciprocally moved and combined between the nozzle body and the heat radiation part, and a reciprocating part which make the transfer body part reciprocate. When a process solution is supplied to the supply nozzle for processing a substrate, the surface tension of the process solution which is stored in the supply nozzle can be increased. |
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The supply nozzle for a processing substrate includes a nozzle body which has a receiving space for receiving a process solution for processing a substrate, a heat radiation part which is separated and fixed to the nozzle body part, a transfer body part which is reciprocally moved and combined between the nozzle body and the heat radiation part, and a reciprocating part which make the transfer body part reciprocate. When a process solution is supplied to the supply nozzle for processing a substrate, the surface tension of the process solution which is stored in the supply nozzle can be increased.</description><language>eng ; kor</language><subject>APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL ; ATOMISING APPARATUS ; BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; NOZZLES ; PERFORMING OPERATIONS ; SEMICONDUCTOR DEVICES ; SPRAYING APPARATUS ; SPRAYING OR ATOMISING IN GENERAL ; TRANSPORTING</subject><creationdate>2014</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20140325&DB=EPODOC&CC=KR&NR=101377657B1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20140325&DB=EPODOC&CC=KR&NR=101377657B1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SONG, NAC HYUN</creatorcontrib><creatorcontrib>LEE, SANG CHON</creatorcontrib><title>PROCESSING NOZZLE FOR PROCESSING SUBSTRATE</title><description>Disclosed is an invention relating to a supply nozzle for a processing substrate. The supply nozzle for a processing substrate includes a nozzle body which has a receiving space for receiving a process solution for processing a substrate, a heat radiation part which is separated and fixed to the nozzle body part, a transfer body part which is reciprocally moved and combined between the nozzle body and the heat radiation part, and a reciprocating part which make the transfer body part reciprocate. When a process solution is supplied to the supply nozzle for processing a substrate, the surface tension of the process solution which is stored in the supply nozzle can be increased.</description><subject>APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL</subject><subject>ATOMISING APPARATUS</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>NOZZLES</subject><subject>PERFORMING OPERATIONS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SPRAYING APPARATUS</subject><subject>SPRAYING OR ATOMISING IN GENERAL</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2014</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNAKCPJ3dg0O9vRzV_Dzj4rycVVw8w9SQBINDnUKDglyDHHlYWBNS8wpTuWF0twMym6uIc4euqkF-fGpxQWJyal5qSXx3kGGBobG5uZmpuZOTobGxKkCABdoJh8</recordid><startdate>20140325</startdate><enddate>20140325</enddate><creator>SONG, NAC HYUN</creator><creator>LEE, SANG CHON</creator><scope>EVB</scope></search><sort><creationdate>20140325</creationdate><title>PROCESSING NOZZLE FOR PROCESSING SUBSTRATE</title><author>SONG, NAC HYUN ; LEE, SANG CHON</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR101377657BB13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; kor</language><creationdate>2014</creationdate><topic>APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL</topic><topic>ATOMISING APPARATUS</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>NOZZLES</topic><topic>PERFORMING OPERATIONS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SPRAYING APPARATUS</topic><topic>SPRAYING OR ATOMISING IN GENERAL</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>SONG, NAC HYUN</creatorcontrib><creatorcontrib>LEE, SANG CHON</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SONG, NAC HYUN</au><au>LEE, SANG CHON</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>PROCESSING NOZZLE FOR PROCESSING SUBSTRATE</title><date>2014-03-25</date><risdate>2014</risdate><abstract>Disclosed is an invention relating to a supply nozzle for a processing substrate. The supply nozzle for a processing substrate includes a nozzle body which has a receiving space for receiving a process solution for processing a substrate, a heat radiation part which is separated and fixed to the nozzle body part, a transfer body part which is reciprocally moved and combined between the nozzle body and the heat radiation part, and a reciprocating part which make the transfer body part reciprocate. When a process solution is supplied to the supply nozzle for processing a substrate, the surface tension of the process solution which is stored in the supply nozzle can be increased.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng ; kor |
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| subjects | APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL ATOMISING APPARATUS BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY NOZZLES PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SPRAYING APPARATUS SPRAYING OR ATOMISING IN GENERAL TRANSPORTING |
| title | PROCESSING NOZZLE FOR PROCESSING SUBSTRATE |
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