PROCESSING NOZZLE FOR PROCESSING SUBSTRATE

Disclosed is an invention relating to a supply nozzle for a processing substrate. The supply nozzle for a processing substrate includes a nozzle body which has a receiving space for receiving a process solution for processing a substrate, a heat radiation part which is separated and fixed to the noz...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	SONG, NAC HYUN, LEE, SANG CHON
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL ATOMISING APPARATUS BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY NOZZLES PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SPRAYING APPARATUS SPRAYING OR ATOMISING IN GENERAL TRANSPORTING
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	Disclosed is an invention relating to a supply nozzle for a processing substrate. The supply nozzle for a processing substrate includes a nozzle body which has a receiving space for receiving a process solution for processing a substrate, a heat radiation part which is separated and fixed to the nozzle body part, a transfer body part which is reciprocally moved and combined between the nozzle body and the heat radiation part, and a reciprocating part which make the transfer body part reciprocate. When a process solution is supplied to the supply nozzle for processing a substrate, the surface tension of the process solution which is stored in the supply nozzle can be increased.