WAFER BONDER USING DUAL-COOLING AND WAFER BONDING METHOD

PURPOSE: A wafer bonder using dual-cooling and a wafer bonding method are provided to cool a wafer by using coolants of different specific heat, thereby maintaining a uniform cooling speed. CONSTITUTION: A wafer is mounted on a first stage (150). A second stage (140) faces the first stage. A transfe...

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Hauptverfasser:	SHIN, HONG SOO, DO, HYUN JUNG
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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creator	SHIN, HONG SOO DO, HYUN JUNG
description	PURPOSE: A wafer bonder using dual-cooling and a wafer bonding method are provided to cool a wafer by using coolants of different specific heat, thereby maintaining a uniform cooling speed. CONSTITUTION: A wafer is mounted on a first stage (150). A second stage (140) faces the first stage. A transfer member (161) moves the first stage or the second stage. A heating member and a cooling member are installed at the first stage. The cooling member cools a wafer.
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subjects	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
title	WAFER BONDER USING DUAL-COOLING AND WAFER BONDING METHOD
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