WAFER BONDER USING DUAL-COOLING AND WAFER BONDING METHOD

WAFER BONDER USING DUAL-COOLING AND WAFER BONDING METHOD

PURPOSE: A wafer bonder using dual-cooling and a wafer bonding method are provided to cool a wafer by using coolants of different specific heat, thereby maintaining a uniform cooling speed. CONSTITUTION: A wafer is mounted on a first stage (150). A second stage (140) faces the first stage. A transfe...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: SHIN, HONG SOO, DO, HYUN JUNG
Format: Patent
Sprache:eng ; kor
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:PURPOSE: A wafer bonder using dual-cooling and a wafer bonding method are provided to cool a wafer by using coolants of different specific heat, thereby maintaining a uniform cooling speed. CONSTITUTION: A wafer is mounted on a first stage (150). A second stage (140) faces the first stage. A transfer member (161) moves the first stage or the second stage. A heating member and a cooling member are installed at the first stage. The cooling member cools a wafer.