THE PRINTED CIRCUIT BOARD MANUFACTURING METHOD

PURPOSE: A method for minimizing the thickness of a flexible printed circuit board with a copper plating part is provided to improve the flexibility of the printed circuit board by reducing deviation between a plated part and a part which is not plated. CONSTITUTION: A hole is processed by a CNC drill(S10). A chemical copper plating process is performed in the hole(S20). A laminating process is performed on both sides of a substrate to coat a dry film and a release sheet(S30). An exposure process is performed on the coated dry film and the coated release sheet(S40). The dry film and the release film are separated by injecting etchants(S50). [Reference numerals] (AA) Start; (BB) End; (S10) Hole processing process; (S20) Chemical copper plating process; (S30) Laminating process; (S40) Exposure process; (S50) Development process; (S60) Partial plating process; (S70) Dry film separating process; (S80) Plating sanding process