THE PRINTED CIRCUIT BOARD MANUFACTURING METHOD

PURPOSE: A method for manufacturing a printed circuit board is provided to quickly manufacture products by reducing the movement time and waiting time for the products. CONSTITUTION: A dry film is coated on a substrate(S10). Ink is coated on the substrate(S20). The substrate is cut into unit substra...

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Bibliographische Detailangaben
Hauptverfasser:	JEONG, SANG HO, JEONG, UI NAM
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR MILLING PERFORMING OPERATIONS PRINTED CIRCUITS TRANSPORTING
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Beschreibung
Zusammenfassung:	PURPOSE: A method for manufacturing a printed circuit board is provided to quickly manufacture products by reducing the movement time and waiting time for the products. CONSTITUTION: A dry film is coated on a substrate(S10). Ink is coated on the substrate(S20). The substrate is cut into unit substrates(S30). An alkali chemical is spread on unit substrates. The coated dry film is removed(S40). [Reference numerals] (S10) Coating a dry film; (S20) Printing SIT(PPI); (S30) Router; (S40) Peeling off