SUB-MOUNT SUBSTRATE FOR SEMICONDUCTOR LIGHT EMITTING ELEMENT AND METHOD OF FABRICATING A SEMICONDUCTOR LIGHT EMITTING ELEMENT USING THE SAME

SUB-MOUNT SUBSTRATE FOR SEMICONDUCTOR LIGHT EMITTING ELEMENT AND METHOD OF FABRICATING A SEMICONDUCTOR LIGHT EMITTING ELEMENT USING THE SAME

PURPOSE: A sub-mount substrate for a semiconductor light emitting element and a manufacturing method for the semiconductor light emitting element using the same are provided to produce a light emitting device of a high efficiency by including a stress release layer. CONSTITUTION: A sacrificial layer...

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Bibliographische Detailangaben
Hauptverfasser: OH, BYUNG DU, LEE, WOO SIK, KU, KYO SUN, JEONG, UNG RAK, SHIN, HYUN WOO
Format: Patent
Sprache:eng ; kor
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:PURPOSE: A sub-mount substrate for a semiconductor light emitting element and a manufacturing method for the semiconductor light emitting element using the same are provided to produce a light emitting device of a high efficiency by including a stress release layer. CONSTITUTION: A sacrificial layer(102) is formed at an upper side of a temporary supporting substrate layer(101). A supporting substrate layer(104) is formed on the sacrificial layer. A bonding layer for a sub mount substrate is formed on the supporting substrate layer. A stress release layer is formed at a lower side of the temporary supporting substrate layer. The stress release layer is formed with a single layer or a laminating structure of 10-2000μm thickness.