SEMICONDUCTOR PACKAGE FOR VERTICAL ADHESION

PURPOSE: A vertical mounting type semiconductor package is provided to make a semiconductor package structure to have a vertical mounting structure, thereby accurately detecting acceleration in x, y, z directions and angular speed. CONSTITUTION: A horizontal frame(12) is horizontally mounted on a te...

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Bibliographische Detailangaben
Hauptverfasser:	KIM, JEONG TAE, KUO BOB SHIH WEI, GALLOWAY JESSE E, JANG, SUNG SIK, JUNG, JONG DAE
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	PURPOSE: A vertical mounting type semiconductor package is provided to make a semiconductor package structure to have a vertical mounting structure, thereby accurately detecting acceleration in x, y, z directions and angular speed. CONSTITUTION: A horizontal frame(12) is horizontally mounted on a test board. A semiconductor chip(30) is attached to a chip mounting section of the horizontal frame. A wire(32) connects the semiconductor chip with an inner lead(17) of the horizontal frame. A cap(40) is coupled with a horizontal molding unit(22). A bonding unit(34) bonds a vertical molding unit(24) with a side of the cap. The vertical molding unit is molded in a vertical frame(14).