A PRINTED CIRCUIT BOARD COMPRISING A BUMP AND A METHOD OF MANUFACTURING THE SAME

PURPOSE: A printed circuit board with a bump and a manufacturing method thereof are provided to manufacture a substrate using an insulation layer and a protection layer with a low thermal expansion coefficient, thereby preventing a bending phenomenon. CONSTITUTION: A buildup circuit layer connected to the first circuit layer is formed on a buildup insulation layer(103). The first protection layer(106) is formed on one side of the buildup insulation layer. The first open part(105) exposes the first pad part on the first circuit layer. The second protection layer(109) is formed on the other side of the buildup insulation layer. The second open part(108) exposes the second pad part on the buildup insulation layer. A bump via(110) is integrated with the first pad part and is formed in the first open part. A bump(111) is protruded from the first protection layer.