MANUFACTURING METHOD OF PCB

PURPOSE: A method for manufacturing a printed circuit board is provided to improve heat dissipation efficiency of an LED by attaching a thermal diffusion sheet to the lower side of the printed circuit board. CONSTITUTION: A height control film is punched after the height control film is laminated on...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	YOUN, KYUNG SEOB, SEO, SEUNG HAN
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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