MANUFACTURING METHOD OF PCB

PURPOSE: A method for manufacturing a printed circuit board is provided to improve heat dissipation efficiency of an LED by attaching a thermal diffusion sheet to the lower side of the printed circuit board. CONSTITUTION: A height control film is punched after the height control film is laminated on...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	YOUN, KYUNG SEOB, SEO, SEUNG HAN
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PURPOSE: A method for manufacturing a printed circuit board is provided to improve heat dissipation efficiency of an LED by attaching a thermal diffusion sheet to the lower side of the printed circuit board. CONSTITUTION: A height control film is punched after the height control film is laminated on the upper side of a printed circuit board(S1). An upper protection film is laminated on the upper side of the height control film(S2). The printed circuit board, the height control film, and the upper protection film are wound with a roll shape(S3). A lower protection film is laminated on the lower side of the printed circuit board(S4). The thermal conductive silicon is interposed between the lower side of the printed circuit board and the lower protection film.