LEAD FREE SOLDER COMPOSITION AVAILABLE FOR SOLDERING TO GLASS

PURPOSE: A lead-free solder composition for car glass soldering is provided to improve resistances against heat or shocks by maintaining the resistance of a soldered portion below 10Ω. CONSTITUTION: A lead-free solder composition for car glass soldering comprises silver 3.0~6.0 weight%, aluminum 0.1...

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Bibliographische Detailangaben
Hauptverfasser:	YOON, HO JUNE, KIM, SEUNG KYU, SONG, KYONG HO, KIM, JE HI
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	PURPOSE: A lead-free solder composition for car glass soldering is provided to improve resistances against heat or shocks by maintaining the resistance of a soldered portion below 10Ω. CONSTITUTION: A lead-free solder composition for car glass soldering comprises silver 3.0~6.0 weight%, aluminum 0.1~1.0 weight%, indium 15.0~ 40 weight%, bismuth 0.5~10.0 weight%, and the remaining weight% in tin. The melting point of the lead free solder composition is 120~140°C. The lead free solder composition is one or more kinds of solder preform selected among solder paste, solder ball, solder bar, solder wire, solder bump, solder film, solder powder, solder pellet, solder particle, solder ribbon, solder washer, solder ring, and solder disc.