WAFER BONDER AND IMPRINT APPARATUS

PURPOSE: A wafer bonder and an imprint apparatus is provided to minimize failures of a wafer by controlling pressure applied to a wafer through a servomotor and a load cell and applying uniform pressure on the wafer. CONSTITUTION: In a wafer bonder and an imprint apparatus, a wafer is mounted on a f...

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Bibliographische Detailangaben

Hauptverfasser:	SHIN, HONG SOO, DO, HYUN JUNG
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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