WAFER BONDER AND IMPRINT APPARATUS

WAFER BONDER AND IMPRINT APPARATUS

PURPOSE: A wafer bonder and an imprint apparatus is provided to minimize failures of a wafer by controlling pressure applied to a wafer through a servomotor and a load cell and applying uniform pressure on the wafer. CONSTITUTION: In a wafer bonder and an imprint apparatus, a wafer is mounted on a f...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: SHIN, HONG SOO, DO, HYUN JUNG
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:PURPOSE: A wafer bonder and an imprint apparatus is provided to minimize failures of a wafer by controlling pressure applied to a wafer through a servomotor and a load cell and applying uniform pressure on the wafer. CONSTITUTION: In a wafer bonder and an imprint apparatus, a wafer is mounted on a first stage(110). A second stage(140) is faced with the first stage. A transfer unit(160) transfers the first stage or the second stage. The heating block(150) is arranged to be adjacent to the first stage while including the heating element(152) and the cooling flow path(154) generating the heat together. The cooling flow path receives nitrogen gas or the cooling water. A hotwire and the cooling flow path are installed at the second stage.