METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD HAVING EMBEDDED ELECTRONIC COMPONENTS

A method for manufacturing a printed circuit board having embedded electronic components is provided to remove a via forming process for connecting a fist and a second substrate by forming a conductive bump on the first substrate. A method for manufacturing a printed circuit board is comprised of th...

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Bibliographische Detailangaben
Hauptverfasser:	KIM, BYOUNG HAG, AN, YONG SOO, KIM, DONG KI, LEE, CHANG JAE
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	A method for manufacturing a printed circuit board having embedded electronic components is provided to remove a via forming process for connecting a fist and a second substrate by forming a conductive bump on the first substrate. A method for manufacturing a printed circuit board is comprised of the steps: forming a conductive bump on a first substrate through a screen print(S100); laminating an insulating member on the first substrate(S200); laminating a second substrate having a cavity corresponding to the device mounting unit on the fist substrate(S300); mounting the electric component is mounted on the device mounting unit through the cavity(S400); and filing the cavity with a filler(S500).