ECHANT FOR LAYERS OF COPPER OR COPPER ALLOY
Echant for a copper or copper alloy film is provided to ensure excellent profile property which has taper less than 60 degree and CD loss of 1 micron or less and good pattern directivity, to prevent the damage of glass plate which is a substrate and to secure long life time. Echant for a copper or c...
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| creator | PARK, HYO JUN JEON, HYUNG JIN WOO, HYUN CHEUN, IL KUN |
| description | Echant for a copper or copper alloy film is provided to ensure excellent profile property which has taper less than 60 degree and CD loss of 1 micron or less and good pattern directivity, to prevent the damage of glass plate which is a substrate and to secure long life time. Echant for a copper or copper alloy film comprises hydrogen peroxide 15~40 wt%, at least one organic acid 1~20 wt% selected from the group consisting of carboxy acid and amino acid, sulfate or fluorate 1~5 wt%, chelating agent 0.01~3 wt%, fluorosurfactant 0.0001~1 wt% and the remaining amount of water. |
| format | Patent |
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Echant for a copper or copper alloy film comprises hydrogen peroxide 15~40 wt%, at least one organic acid 1~20 wt% selected from the group consisting of carboxy acid and amino acid, sulfate or fluorate 1~5 wt%, chelating agent 0.01~3 wt%, fluorosurfactant 0.0001~1 wt% and the remaining amount of water.</description><language>eng</language><subject>ADHESIVES ; CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS ; CHEMISTRY ; DYES ; GLASS ; JOINING GLASS TO GLASS OR OTHER MATERIALS ; MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE ; METALLURGY ; MINERAL OR SLAG WOOL ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; PAINTS ; POLISHES ; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS ; SURFACE TREATMENT OF GLASS</subject><creationdate>2009</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20090217&DB=EPODOC&CC=KR&NR=100883960B1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20090217&DB=EPODOC&CC=KR&NR=100883960B1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>PARK, HYO JUN</creatorcontrib><creatorcontrib>JEON, HYUNG JIN</creatorcontrib><creatorcontrib>WOO, HYUN</creatorcontrib><creatorcontrib>CHEUN, IL KUN</creatorcontrib><title>ECHANT FOR LAYERS OF COPPER OR COPPER ALLOY</title><description>Echant for a copper or copper alloy film is provided to ensure excellent profile property which has taper less than 60 degree and CD loss of 1 micron or less and good pattern directivity, to prevent the damage of glass plate which is a substrate and to secure long life time. 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Echant for a copper or copper alloy film comprises hydrogen peroxide 15~40 wt%, at least one organic acid 1~20 wt% selected from the group consisting of carboxy acid and amino acid, sulfate or fluorate 1~5 wt%, chelating agent 0.01~3 wt%, fluorosurfactant 0.0001~1 wt% and the remaining amount of water.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng |
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| subjects | ADHESIVES CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS CHEMISTRY DYES GLASS JOINING GLASS TO GLASS OR OTHER MATERIALS MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MINERAL OR SLAG WOOL MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS POLISHES SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS SURFACE TREATMENT OF GLASS |
| title | ECHANT FOR LAYERS OF COPPER OR COPPER ALLOY |
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