LIGHT EMITTING DIODE PACKAGE WITHOUT SURFACE MOUNT AND ITS PRODUCTION METHOD

A light emitting diode package without surface mount and a manufacturing method thereof are provided to exchange easily components by eliminating a soldering operation in a rework process. A hardening unit(100) is made of a metal material including copper, aluminum, and alloy. The hardening unit has high heat conductivity. A polyimide(110) is formed on an upper part of the hardening unit and is used as an insulating layer. A metal line(120) is attached on an upper part of the polyimide in order to perform an electrical connection function. One or more light emitting diodes(130) is formed on an upper part of the metal line in order to emit light. A mold unit(140) is formed on an upper part of the metal line and includes a light emitting diode. A protective film(150) is formed on an upper part of the metal line on which the mold unit is not formed. The protective film is formed to protect a copper wiring.