BONDING HEAD FOR BONDING MACHINE

A chip transfer head of bonding equipment is provided to minimize loss of a chip in a process for transferring the chip to a bonding head by preventing a breakdown of a chip buffer. A driving unit is installed in a unit body(91). A fixing body(110) is fixed to the driving unit and is rotated by usin...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser:	CHOI, HAN HYOUN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	A chip transfer head of bonding equipment is provided to minimize loss of a chip in a process for transferring the chip to a bonding head by preventing a breakdown of a chip buffer. A driving unit is installed in a unit body(91). A fixing body(110) is fixed to the driving unit and is rotated by using the driving force of the driving unit. A head(150) is movably coupled with the fixing body and is rotated around the fixing body according to the rotation of the fixing body to absorb a chip from a lower side and to transfer the chip to an upper side. A head pulling unit pulls the head from the lower side to reduce a contact shock between the head and the chip. A head supporting unit is connected to the head and the fixing body to support elastically the head.