METHOD OF PREPARING LOW RESISTANCE METAL LINE, PATTERNED METAL LINE STRUCTURE, AND DISPLAY DEVICES USING THE SAME

A low resistance metal line forming method, a metal line structure and a display device using the same are provided to obtain a low resistance metal line efficiently within a short time by using a wet film forming process, thereby significantly reducing an amount invested in equipment and reducing m...

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Bibliographische Detailangaben
Hauptverfasser: PARK, SANG EUN, CHO, SUNG HEN, SONG, KI YONG
Format: Patent
Sprache:eng
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Zusammenfassung:A low resistance metal line forming method, a metal line structure and a display device using the same are provided to obtain a low resistance metal line efficiently within a short time by using a wet film forming process, thereby significantly reducing an amount invested in equipment and reducing manufacturing costs. On an upper part of a substrate(10), a latent mask pattern of a metal line is formed. On the upper part of the substrate where the latent pattern is formed, a self assembled monolayer(20) is applied. By activating the substrate coated with the self assembled monolayer, a seed layer(30) is formed on the surface. A sub metal film(40) is plated on an upper part of the seed layer. The latent mask pattern and its upper part are lifted off to be removed. After that, a metal layer(50) is plated on an upper part of the sub metal film where the pattern is formed.