SEMICONDUCTOR CHIP PACKAGE, CHIP SET AND METHOD FOR FABRICATING SEMICONDUCTOR CHIP

A semiconductor chip package, a chip set, and a method of manufacturing a semiconductor chip are provided to allow target level security by extending a voltage trimming range. A semiconductor chip package has a laminate structure of a DC chip(30) and at least one main chips(20a,20b). The DC chip inc...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LEE, HI CHOON, CHOO, CHUL HWAN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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