SEMICONDUCTOR CHIP PACKAGE, CHIP SET AND METHOD FOR FABRICATING SEMICONDUCTOR CHIP

A semiconductor chip package, a chip set, and a method of manufacturing a semiconductor chip are provided to allow target level security by extending a voltage trimming range. A semiconductor chip package has a laminate structure of a DC chip(30) and at least one main chips(20a,20b). The DC chip includes a DC generation circuits generating DC voltages necessary for an operation of the main chips. The main chip includes circuits responding a DC signal generated by at least one circuit among the DC generation circuits. The DC generation circuits include at least one of a VCCH generation circuit for initialization, a reference voltage generation circuit generating a reference voltage, an array voltage and peripheral voltage generation circuit generating an array voltage and a peripheral voltage, a VPP generation circuit boosting a voltage of a word line, and a VBB generation circuit biasing a memory cell.