CAMERA MODULE AND METHOD OF FABRICATING THE SAME

A camera module and a method for manufacturing the same are provided to decrease a volume of the camera module, by manufacturing the camera module such that a lens member, a filter member, and a stop member are closely attached to one another. A semiconductor package(120) includes an image sensor ch...

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Bibliographische Detailangaben
1. Verfasser:	KONG, YUNG CHEOL
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PICTORIAL COMMUNICATION, e.g. TELEVISION SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A camera module and a method for manufacturing the same are provided to decrease a volume of the camera module, by manufacturing the camera module such that a lens member, a filter member, and a stop member are closely attached to one another. A semiconductor package(120) includes an image sensor chip(105). A transparent substrate(140) has an upper plate portion and a support portion, which are defined by a cavity. The support portion is attached to the semiconductor package, and the upper plate portion is distanced from the semiconductor package by the support portion. A lens member(155) is attached to the upper plate portion of the transparent substrate. A stop member(160) is formed on the transparent substrate to expose a portion of the lens member.