FABRICATING METHOD OF PRINTED CIRCUIT BOARD

A method for fabricating a printed circuit board is provided to realize a fine pattern by reducing thickness of the printed circuit board without use of a CCL(Copper Clad Laminate) as a base substrate. A method for fabricating a printed circuit board includes the steps of: electrifying metallic powder electrified according a circuit pattern(106) to a transfer body; preparing a raw material with an adhesive film adhered at one surface of a substrate; electrifying the raw material with opposite polarity to the metallic powder; forming the circuit pattern on the adhesive film by contacting the raw material to the transfer body; applying an insulating material on the circuit pattern; and forming a core layer by removing the insulating material of the top of the circuit pattern and the adhesive film and the substrate of the bottom of the circuit pattern.