LCD THE CHIP ON FILM NON-CONDUCTIVE PASTE

An apparatus for packaging a COF(Chip On Film) NCP(Non-Conductive Paste) for an LCD is provided to pressurize and fix a fine chip onto a film through precise force control of a micro actuator, thereby minimizing open defects caused by bonding between the film and the fine chip and damage of the film...

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Bibliographische Detailangaben
1. Verfasser:	SIM, JAE HONG
Format:	Patent
Sprache:	eng
Schlagworte:	DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING FREQUENCY-CHANGING NON-LINEAR OPTICS OPTICAL ANALOGUE/DIGITAL CONVERTERS OPTICAL LOGIC ELEMENTS OPTICS PHYSICS TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF
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Beschreibung
Zusammenfassung:	An apparatus for packaging a COF(Chip On Film) NCP(Non-Conductive Paste) for an LCD is provided to pressurize and fix a fine chip onto a film through precise force control of a micro actuator, thereby minimizing open defects caused by bonding between the film and the fine chip and damage of the film and the fine chip. A transport unit(20) is fixed to an upper portion of a main body(21) above a working plate. The transport unit moves upwardly and downwardly. A micro actuator unit(30) has a cover(31) fixed to one side of the transport unit. The cover of the micro actuator unit is transported upwardly and downwardly by the transport unit to pressurize a fine chip(12) onto a film(11). A horizontal unit(40) is positioned below the micro actuator unit to receive the film on which the fine chip is mounted. The horizontal unit supports the film in a horizontal state while the fine chip is pressurized onto the film by the micro actuator unit.