METHOD FOR WAFER TEST AND PROBE CARD FOR THE SAME

A wafer test method and a probe card used in the same are provided to prevent a probe card from being asymmetrically thermal-deformed by evenly disposing micro probes on the entire surface of the probe card. Repeat units(610) consisting of N semiconductor chips are set on a wafer(600), in which N is...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SONG, BYUNG CHANG, CHUNG, IN BUHM
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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