METHOD FOR WAFER TEST AND PROBE CARD FOR THE SAME

METHOD FOR WAFER TEST AND PROBE CARD FOR THE SAME

A wafer test method and a probe card used in the same are provided to prevent a probe card from being asymmetrically thermal-deformed by evenly disposing micro probes on the entire surface of the probe card. Repeat units(610) consisting of N semiconductor chips are set on a wafer(600), in which N is...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: SONG, BYUNG CHANG, CHUNG, IN BUHM
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A wafer test method and a probe card used in the same are provided to prevent a probe card from being asymmetrically thermal-deformed by evenly disposing micro probes on the entire surface of the probe card. Repeat units(610) consisting of N semiconductor chips are set on a wafer(600), in which N is a natural number from 2 to 20. The repeat units are evenly disposed on the entire surface of the wafer in such a manner that the repeat units are not overlapped. A probe card(500) or the wafer is moved N times so that the semiconductor chips in the repeat units is tested one by one every one touchdown. A micro probe is formed only on a region corresponding to one of N semiconductor chips.