SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

A semiconductor package and a method for preparing the semiconductor package are provided to improve the confidence of package of a semiconductor by suppressing expansion of a packaging material with low modulus by using a packaging material with high modulus. A semiconductor package(100) comprises a semiconductor chip(110); a substrate(120) where the semiconductor chip is adhered; a wire(130) which connects electrically the semiconductor chip and the substrate; an external contact terminal which connects electrically the semiconductor chip and the outside; and a packaging material(136) which packages the wire and its surroundings and comprises a plurality of insulating materials(132, 134) of different physical properties. Preferably the plurality of insulating materials has different modulus.