TAPE SUPPORTING APPARATUS OF SEMICONDUCTOR DEVICE MANUFACTURING POTTING MACHINE

A tape support device for a resin application apparatus in fabrication of a semiconductor device is provided to apply a resin onto various kinds of tapes by freely installing a vacuum jig at an optional position over the whole length of the tape positioned on a transfer rail. A driving unit is posit...

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Bibliographische Detailangaben
1. Verfasser:	KANG, BYUNG HWAN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A tape support device for a resin application apparatus in fabrication of a semiconductor device is provided to apply a resin onto various kinds of tapes by freely installing a vacuum jig at an optional position over the whole length of the tape positioned on a transfer rail. A driving unit is positioned under a transfer rail carrying a tape, and an LM(Linear Motor) guide unit is coupled to the driving unit and is moved up and down by the driving unit. Each of vacuum jigs is coupled to plural sliding blocks of the LM guide unit to support firmly the tape. Each of support units is positioned at both sides of the LM guide unit to guide motion of the LM guide unit and support the LM guide unit.