APPARATUS AND METHOD FOR TREATING SUBSTRATES

An apparatus and a method for processing a substrate are provided to reduce equipment volume of the substrate process apparatus by providing a triangle-shaped substrate transfer module and having chambers whose process rooms are arranged along a sidewall of the substrate transfer module. A container...

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Bibliographische Detailangaben
Hauptverfasser: SEO, BYONG KYU, PARK, SOON CHON, CHOI, KYUE SANG, KIM, KI SANG
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:An apparatus and a method for processing a substrate are provided to reduce equipment volume of the substrate process apparatus by providing a triangle-shaped substrate transfer module and having chambers whose process rooms are arranged along a sidewall of the substrate transfer module. A container accommodating substrates is positioned on a load port(20). A substrate transfer module is located between the load port and a process room. A robot is provided on the substrate transfer module to transfer the substrate between the load port and the process room. The substrate transfer module includes a first sidewall(12), a second sidewall(14), and a third sidewall(16). The second sidewall is formed to be tilted with the first sidewall at an end of the first sidewall or an adjacent region thereto. The third sidewall is formed to be tilted with the first sidewall at the other end of the first sidewall or an adjacent region thereto. The load port is provided along the first sidewall. The process room includes plural chambers arranged along the second sidewall and the third sidewall. The process room includes a first transfer chamber(36), a second transfer chamber(37), a first process chamber, a second process chamber(32), and a third process chamber(33). The first transfer chamber where a robot transferring the substrate is installed is provided at a side of the second sidewall. The second transfer chamber where a robot transferring the substrate is installed is provided at a side of the third sidewall. The first process chamber has a sidewall opposite to the first transfer chamber and a sidewall opposite to the second transfer chamber. The second process chamber is provided on a position opposite to the first process chamber on the basis of the first transfer chamber. The third process chamber is provided on a position opposite to the first process chamber on the basis of the second transfer chamber.