SUBSTRATE PROCESSING APPARATUS OF A SINGLE SUBSTRATE TYPE

A substrate processing apparatus of a single wafer type is provided to decrease recontamination of a semiconductor substrate while the substrate is processed by using a process solution. A chamber(102) has an opened upper portion and an opened lower portion. A bottom panel(104) is detachably engaged...

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Hauptverfasser: HONG, CHANG KI, LEE, KUN TACK, HAN, JEONG NAM, SHIM, WOO GWAN, LEE, KANG YOUN, KIM, IN GI, KIM, YOUNG OK
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creator HONG, CHANG KI
LEE, KUN TACK
HAN, JEONG NAM
SHIM, WOO GWAN
LEE, KANG YOUN
KIM, IN GI
KIM, YOUNG OK
description A substrate processing apparatus of a single wafer type is provided to decrease recontamination of a semiconductor substrate while the substrate is processed by using a process solution. A chamber(102) has an opened upper portion and an opened lower portion. A bottom panel(104) is detachably engaged to the opened lower portion. A solution supply unit(110) is connected to the bottom panel to supply a process solution for processing a substrate(10) into the chamber. A substrate holder(122) holds both sides of the substrate to position vertically the substrate in the chamber. The bottom panel is coupled to the lower portion of the chamber by plural coupling members(106).
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title SUBSTRATE PROCESSING APPARATUS OF A SINGLE SUBSTRATE TYPE
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