SUBSTRATE PROCESSING APPARATUS OF A SINGLE SUBSTRATE TYPE

A substrate processing apparatus of a single wafer type is provided to decrease recontamination of a semiconductor substrate while the substrate is processed by using a process solution. A chamber(102) has an opened upper portion and an opened lower portion. A bottom panel(104) is detachably engaged...

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Bibliographische Detailangaben
Hauptverfasser:	HONG, CHANG KI, LEE, KUN TACK, HAN, JEONG NAM, SHIM, WOO GWAN, LEE, KANG YOUN, KIM, IN GI, KIM, YOUNG OK
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A substrate processing apparatus of a single wafer type is provided to decrease recontamination of a semiconductor substrate while the substrate is processed by using a process solution. A chamber(102) has an opened upper portion and an opened lower portion. A bottom panel(104) is detachably engaged to the opened lower portion. A solution supply unit(110) is connected to the bottom panel to supply a process solution for processing a substrate(10) into the chamber. A substrate holder(122) holds both sides of the substrate to position vertically the substrate in the chamber. The bottom panel is coupled to the lower portion of the chamber by plural coupling members(106).