ANISOTROPIC CONDUCTIVE ADHESIVE COMPOSITION INCLUDING TWO OR MORE HARDENERS HAVING DIFFERENT MELTING POINT

An anisotropic conductive adhesive composition, and an anisotropic conductive film prepared by using the composition are provided to improve curing velocity even at a low temperature, to improve adhesive strength and to lower the contact resistance of the anisotropic conductive film. An anisotropic...

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Bibliographische Detailangaben
Hauptverfasser:	KANG, JUNG KU, KIM, HYOUN YOUNG, CHOI, JUNG SIK, HWANG, JA YOUNG
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	An anisotropic conductive adhesive composition, and an anisotropic conductive film prepared by using the composition are provided to improve curing velocity even at a low temperature, to improve adhesive strength and to lower the contact resistance of the anisotropic conductive film. An anisotropic conductive adhesive composition comprises an epoxy resin; at least two kinds of epoxy resin curing agents having different melting points; a conductive particle; and a solvent, wherein the at least two kinds of epoxy resin curing agents having different melting points are molten at a temperature above 40 deg.C. The difference of caloric value of the at least two epoxy resin curing agents is 1-30 deg.C when the temperature difference of peaks is measured by using a differential scanning calorimeter.