MOLD FOR MOLDING TEST PIECE FOR WARPAGE MEASUREMENT OF PACKAGE RESIN AND MOLDING METHOD OF TEST PIECE

A mold for manufacturing a test piece for a warpage measurement of a package resin and a manufacturing method thereof are provided to control the generation of warpage by improving flow and modulus of the package resin. A lower block(21) has an internal space. An upper plate(10) has an injection hol...

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Bibliographische Detailangaben
Hauptverfasser:	CHO, HEE JAI, PARK, JI SEUNG, CHA, OK JA, KIM, YOUNG CHUL, LEE, JEONG HEUM
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A mold for manufacturing a test piece for a warpage measurement of a package resin and a manufacturing method thereof are provided to control the generation of warpage by improving flow and modulus of the package resin. A lower block(21) has an internal space. An upper plate(10) has an injection hole(11) for injecting a resin. The upper plate closes an upper portion of the lower block and is assembled. A middle block(12) has a runner(13) through the injection hole. The middle block is arranged in the internal space of the lower block to form a cavity. A support block(15) is arranged on a lower portion of the middle block in the internal space of the lower block and varies cavity capacity. A driving unit is arranged in the internal space of the lower block and raises or drops the support block.