MOLDING METHOD OF BONDING SHEET

A method for molding of bonding sheets using vacuum laminator is provided to allow automation of the molding process of bonding sheets, to save time required processing, and to reduce material cost for subsidiary members. The method for molding of bonding sheets using vacuum laminator includes: supp...

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Bibliographische Detailangaben
Hauptverfasser:	YANG, DEK GIN, CHAI, JUNG HUN, AN, DONG GI, LEE, YANG JE, HWANG, JUNG WOOK, HWANG, SUN OH
Format:	Patent
Sprache:	eng
Schlagworte:	LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM PERFORMING OPERATIONS TRANSPORTING
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Beschreibung
Zusammenfassung:	A method for molding of bonding sheets using vacuum laminator is provided to allow automation of the molding process of bonding sheets, to save time required processing, and to reduce material cost for subsidiary members. The method for molding of bonding sheets using vacuum laminator includes: supplying at least more than one of coppery laminated plate having a transiently attached bonding sheet; and heating and pressurizing the supplied coppery laminated plates one by one for attaching the boding sheet on the coppery laminated plate permanently. The above stage of heating and pressurizing includes: transferring a coppery laminated plate from supplying part to molding part; molding the transiently attached bonding sheet on the coppery laminated plate by heating and pressurizing; and then transferring the molded coppery laminated plate toward discharging part.