SOLDER PASTE SPREADING DEVICE

A solder paste spreading apparatus is provided to improve fillability of a hole and to remove a void by using an air pressure. A solder paste spreading apparatus includes a main body(1), a squeeze(2), and an air pressure generator(3). The main body unit(1) is located on an upper part of a metal mask...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	SIM, KI DONG
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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