SOLDER PASTE SPREADING DEVICE

A solder paste spreading apparatus is provided to improve fillability of a hole and to remove a void by using an air pressure. A solder paste spreading apparatus includes a main body(1), a squeeze(2), and an air pressure generator(3). The main body unit(1) is located on an upper part of a metal mask, and moves to a predetermined direction. The squeeze(2) is connected to a bottom end of the main body unit(1), and is contacted with the upper part of the metal mask. The squeeze(2) includes a squeeze plate and a fixing member for connecting the squeeze plate to the main body unit(1). The squeeze plate is connected to the main body unit(1) so that the squeeze plate is slanted at a certain degree in response to the moving direction of the main body unit(1). The air pressure generator(3) is connected to the main body unit(1) or the squeeze(2). The air pressure generator(3) is located in a rear part of the squeeze(2) in a moving direction of the main body unit(1).