SOLDER BONDING METHOD FOR SPUTTERING TARGET

A method for bonding between a sputtering target and a backing plate using a solder is provided, in which under the state in which the bonding surfaces of the sputtering target and the backing plate are immersed in the melted solder, a cloth is placed and passed between the bonding surfaces, thereby...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser:	SONG, JERNG SIK
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A method for bonding between a sputtering target and a backing plate using a solder is provided, in which under the state in which the bonding surfaces of the sputtering target and the backing plate are immersed in the melted solder, a cloth is placed and passed between the bonding surfaces, thereby sweeping out oxides and air bubbles between the bonding surfaces.