METHOD FOR ALIGNING WAFER LOADER

PURPOSE: A method for aligning a wafer loader is provided to be capable of aligning a wafer by using adjacency sensors instead of costly line CCD(Charge-Coupled Device). CONSTITUTION: A wafer(10) being out of position is taken out of a cassette(11) and located under a camera(12) by a robot arm(13). At this time, two edge portions of the wafer(10) is recognized by the camera(12). After evaluating the value of a wafer deviation, the wafer(10) is loaded on a chuck(14) by the robot arm(13). At this time, the center portion of the wafer(10) is aligned with the center portion of the chuck(14) because the wafer(10) is adjusted according to the value of the wafer deviation. The orientation of the wafer(10) is evaluated by detecting a notch portion of the wafer(10) by using adjacency sensors(S1,S2,S3) instead of costly line CCD. After adjusting the orientation of the wafer(10), the wafer(10) is loaded on a predetermined position by the robot arm(13).