OPTICAL TRANSMITTING AND RECEIVING MODULE
PURPOSE: An optical transmitting and receiving module is provided to solve a process difficulty in assembling two can packages by simultaneously inserting a laser diode and a photo diode within one plastic package with a lens fixed therein and facilitate fabrication by combining a connector holder w...
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Format: | Patent |
Sprache: | eng ; kor |
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Zusammenfassung: | PURPOSE: An optical transmitting and receiving module is provided to solve a process difficulty in assembling two can packages by simultaneously inserting a laser diode and a photo diode within one plastic package with a lens fixed therein and facilitate fabrication by combining a connector holder with the plastic package. CONSTITUTION: A plastic package(20) includes a lead frame, a laser diode(22) for converting an electric signal into an optical signal, a photo diode(23) for converting an optical signal into an electric signal, and two lenses(24,25) for effectively focussing light. The two lenses(24,25) are fixed by a lens fixing groove(28) and integrally combined with a plastic package(20). An optical fiber connector(30) includes two fibers(31,32) for light transmission. A connector holder(40) fixes the plastic package(20) and the optical fiber connector(30) and combined with the plastic package(20) as one body. The lead frame(21) is connected to a main board(PCB) to transmit an electric signal. The laser diode(22) and the photo diode (23) are inserted on the lead frame(21) together one. The laser diode(22) is driven by a power transferred through the lead frame(21) connected to the main board. The optical signal of light emitted from the laser diode(22) is transmitted along the fiber(31) of the optical fiber connector(30) through the lens(24). The optical signal received by the fiber(32) of the optical fiber connector(30) is focussed on the photo diode(23) of the plastic package(20) through the lens(25). The photo diode(23) converts the inputted optical signal into an electric signal and transmits it to the main board through the lead frame(21). |
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