ELECTRO-DEPOSITED COPPER FOIL FOR PRINTING CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

PURPOSE: An electro-deposited copper foil is provided which improves a bonding strength with an insulation substrate as well as heat resistance and chemical resistance by forming a barrier layer of Zn-As alloy on the surface of the electro-deposited copper foil, and a method for manufacturing the electro-deposited copper foil is provided. CONSTITUTION: In forming a barrier layer on the surface of a raw copper foil obtained by electro-deposition, the method for manufacturing the electro-deposited copper foil for a printing circuit board is characterized in that the barrier layer of Zn-As alloy is formed by electrolytic treating the raw copper foil in an electrolyte in which zinc sulfate containing 0.1 to 20 g/L of metal zinc, arsenious aid containing 0.5 to 5 g/L of metal arsenic, and potassium pyrophosphate(K4P2O7) of 10 to 200 g/L are mixed under the conditions that a temperature of the electrolytic solution is 20 to 50 deg.C, a treatment time is 2 to 20 seconds, pH is 9 to 13, and a cathode current density is 0.5 to 20 A/dm¬3, wherein a second layer can be formed on the barrier layer of Zn-As alloy in an electrolyte in which zinc sulfate containing 0.1 to 20 g/L of metal zinc, tin sulfate containing 0.1 to 10 g/L of metal tin, and potassium pyrophosphate(K4P2O7) of 10 to 300 g/L are mixed under the conditions that a temperature of the electrolytic solution is 20 to 50 deg.C, a treatment time is 2 to 20 seconds, pH is 9 to 13, and a cathode current density is 0.5 to 20 A/dm¬3.