EPOXY RESIN COMPOSITION

PURPOSE: An epoxy resin composition containing a specified phenol epoxy resin is provided which has low moisture absorption, the low coefficient of thermal expansion, high fluidity and improved heat resistance. CONSTITUTION: An epoxy resin composition comprises (A)from 1 to 99% by weight of phenol epoxy resin of formula I based on the total weight of the epoxy resin, (B)from 1 to 99% by weight of epoxy resin different from the formula I based on the total weight of the epoxy resin and (C)from 1 to 90% by weight of curing agent based on the total weight of the epoxy resin. In formula, n is 0 or 1, R1,R2,R3 have the meanings given in the description. The epoxy resin composition is particularly suitable for encapsulating semiconductor devices since the composition has a good mold ability and cures into a product having the low coefficient of expansion, heat resistance and low moisture absorption. It can be also used for a molding material, a powder coating material, a printed circuit board material, and adhesives.