USING CERAMIC WAFER TO PROTECT SUSCEPTOR DURING CLEANING OF A PROCESSING CHAMBER

본 방법은 제공된 챔버내에 세정제가 유입되기 전에 서셉터 상에 세라믹 웨이퍼를 로딩함으로써 세정 작용 동안 서셉터를 보호하기 위한 방법 및 장치에 관한 것이다. 특히, 세라믹 웨이퍼는 더 많은 플리즈마가 챔버의 벽을 향하여 세정 작용동안 서셉터로부터 멀리 플라즈마를 전개하기 위해 플리즈마의 전계를 변경하기에 충분한 유전 값을 가지도록 선택된다. A method and apparatus for protecting a susceptor during a cleaning operation by loading a ceramic wafer o...

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Bibliographische Detailangaben
Hauptverfasser:	LAXMAN, MURUGESH, GANA, A RIMPLE, ANAND, GUPTA, SRIHARA, PONNEKANTI
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY CLEANING CLEANING IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY PERFORMING OPERATIONS PREVENTION OF FOULING IN GENERAL SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TRANSPORTING
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Zusammenfassung:	본 방법은 제공된 챔버내에 세정제가 유입되기 전에 서셉터 상에 세라믹 웨이퍼를 로딩함으로써 세정 작용 동안 서셉터를 보호하기 위한 방법 및 장치에 관한 것이다. 특히, 세라믹 웨이퍼는 더 많은 플리즈마가 챔버의 벽을 향하여 세정 작용동안 서셉터로부터 멀리 플라즈마를 전개하기 위해 플리즈마의 전계를 변경하기에 충분한 유전 값을 가지도록 선택된다. A method and apparatus for protecting a susceptor during a cleaning operation by loading a ceramic wafer onto the susceptor before introducing the cleaning agent into the chamber is provided. In particular, the ceramic wafer is chosen to have a dielectric value sufficient to alter the electromagnetic field of a plasma to spread the plasma away from the susceptor during a cleaning operation, directing more of the plasma towards the walls of the chamber.