ELECTRONIC COMPONENT TO BE SURFACE MOUNTED
PURPOSE:To provide a surface-mount electronic part fitted with a terminal excellent in solderability easy to form a solder fillet. CONSTITUTION:Within the title surface-mount electronic part having a terminal 12 extending from the side of an electronic part main body 11 to be bent to the bottom side...
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | PURPOSE:To provide a surface-mount electronic part fitted with a terminal excellent in solderability easy to form a solder fillet. CONSTITUTION:Within the title surface-mount electronic part having a terminal 12 extending from the side of an electronic part main body 11 to be bent to the bottom side of the main body 11, a bottleneck part 13 for facilitating the bending step is provided on the position of the terminal 12 corresponding to the side of the main body 11. |
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