ELECTRONIC COMPONENT TO BE SURFACE MOUNTED

PURPOSE:To provide a surface-mount electronic part fitted with a terminal excellent in solderability easy to form a solder fillet. CONSTITUTION:Within the title surface-mount electronic part having a terminal 12 extending from the side of an electronic part main body 11 to be bent to the bottom side...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: UEDA, YUKINORI
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:PURPOSE:To provide a surface-mount electronic part fitted with a terminal excellent in solderability easy to form a solder fillet. CONSTITUTION:Within the title surface-mount electronic part having a terminal 12 extending from the side of an electronic part main body 11 to be bent to the bottom side of the main body 11, a bottleneck part 13 for facilitating the bending step is provided on the position of the terminal 12 corresponding to the side of the main body 11.