MOUNTING DEVICE FOR SEMICONDUCTOR COMPONENT

PURPOSE:To allow transcription of an adhesive agent for an area corresponding to the size of a component to be mounted by forming an inclined stamp face, and changing the height of the stamp face from the bottom of a stamp base while adjusting the projecting length of a pin. CONSTITUTION:Information concerning a component to be mounted is sent to a control device 4, which, for the component, controls a motor 33 in terms of the relation between a transcription area of an adhesive agent and the projecting length of a pin, and causes the pin 2 to be projected or a required length lfrom a stamp face 11 by operating a lifting and lowering mechanism. Then by lowering the entire transcribing device, the tip of the pin 2 is made to come in contact with the bottom face of a stamp base 5. According to the constitution, the adhesive agent 6 is adhered to the transcription area on the stamp face 11 of a stamp 1. By moving the stamp 1 to which the adhesive agent 6 has been adhered, and by transcribing the adhesive agent 6 while lowering the stamp 1 to a predetermined position on a board 7 on which to mount a component, a predetermined size of the adhesive agent 6 is transcribed onto the board 7.