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PURPOSE:To prevent the adhesion of a bonding agent to the region of a lead wire requiring no application of the bonding agent as well is to reduce the occupation area of a printed substrate by a method wherein a ferrite bead is inserted into one leg part of a U-shaped lead wire, it is fixed by a bon...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	SAITO TOMIKAZU, SAKAMOTO YUKIO, FUTAMURA TOSHIAKI, NISHIGAHANA MASAHARU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INDUCTANCES MAGNETS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES TRANSFORMERS
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Beschreibung
Zusammenfassung:	PURPOSE:To prevent the adhesion of a bonding agent to the region of a lead wire requiring no application of the bonding agent as well is to reduce the occupation area of a printed substrate by a method wherein a ferrite bead is inserted into one leg part of a U-shaped lead wire, it is fixed by a bonding agent, and an engaging part of the ferrite bead is formed on the other leg part. CONSTITUTION:A ferrite bead 2 is inserted into one leg part 1a from the loose end side of a lead wire 1 in such a manner that the bead 2 comes in contact with the base part 1c. Also, an engaging part 3 is formed on the other leg part 1b of the lead wire 1 almost at the same position as the end face of the loose end side of the lead wire 1 of the ferrite bead 2. Pertaining to the fixing of the ferrite bead 2 using a bonding agent, after the ferrite bead 2 has been inserted into the leg part 1a, the lead wire 1 is dipped into the bonding agent coating solution with the base part 1c positioned on the lower side, the lead wire is picked up, and the bonding agent is hardened.